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| Part number: ZM2BBCRBG45S-A www.SunLED.com 3.5x2.8mm SURFACE MOUNT SMD CHIP LED PRELIMINARY SPEC Features OUTSTANDING MATERIAL EFFICIENCY. LOW POWER CONSUMPTION. ONE BLUE , ONE ORANGE AND ONE GREEN CHIPS IN ONE PACKAGE. CAN PRODUCE ANY COLOR IN VISIBLE SPECTRUM, INCLUDING WHITE LIGHT. SUITABLE FOR ALL SMT ASSEMBLY AND SOLDER PROCESS. AVAILABLE ON TAPE AND REEL. MOISTURE SENSITIVITY LEVEL : LEVEL 4. PACKAGE: 1500PCS / REEL . RoHS COMPLIANT. ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.008") unless otherwise noted. 3.Specifications are subject to change without notice. Absolute Maximum Ratings M2BB M2CR M2BG (InGa (AlIn (InGa Unit (TA=25C) N) GaP) N) Reverse Voltage Forward Current Forward Current (Peak) 1/10 Duty Cycle 0.1ms Pulse Width Power Dissipation Operating Temperature Storage Temperature Electrostatic Discharge Threshold (HBM) VR IF iFS PT TA Tstg 1000 5 30 100 111 5 50 150 140 -40 ~ +85 -40 ~ +85 1000 5 30 100 111 V mA mA mW C V Operating Characteristics (TA=25C) Forward Voltage (Typ.) (IF=20mA) Forward Voltage (Max.) (IF=20mA) Reverse Current (Max.) (VR=5V) Wavelength Of Peak Emission (Typ.) (IF=20mA) Wavelength Of Dominant Emission (Typ.) (IF=20mA) Spectral Line Full Width At Half-Maximum (Typ.) (IF=20mA) Capacitance (Typ.) (VF=0V, f=1MHz) Part Number Emitting Color Emitting Material Luminous Intensity (IF=20mA) mcd min. Blue ZM2BBCRBG45S-A Red Green InGaN AlInGaP InGaN Water Clear 110 900 650 typ. 317 1690 1195 M2BB M2CR M2BG (InGa (AlInG (InGa N) aP) N) 3.2 3.7 10 2.2 2.8 10 3.2 3.7 10 Unit VF VF IR V V uA P 458 640 525 nm D 465 630 535 nm 22 25 39 nm C 110 27 65 pF Lens-color Wavelength nm P Viewing Angle 2 1/2 458 640 525 120 Published Date : FEB 25,2008 Drawing No : SDSA6178 V1 Checked : B.L.LIU P.1/7 Part number: ZM2BBCRBG45S-A www.SunLED.com 3.5x2.8mm SURFACE MOUNT SMD CHIP LED Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might leads to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Outside impact may scratch the silicone lens or damage the internal circuitry. 4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. 5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. Published Date : FEB 25,2008 Drawing No : SDSA6178 V1 Checked : B.L.LIU P.2/7 Part number: ZM2BBCRBG45S-A www.SunLED.com 3.5x2.8mm SURFACE MOUNT SMD CHIP LED M2BB Published Date : FEB 25,2008 Drawing No : SDSA6178 V1 Checked : B.L.LIU P.3/7 Part number: ZM2BBCRBG45S-A www.SunLED.com 3.5x2.8mm SURFACE MOUNT SMD CHIP LED M2CR Published Date : FEB 25,2008 Drawing No : SDSA6178 V1 Checked : B.L.LIU P.4/7 Part number: ZM2BBCRBG45S-A www.SunLED.com 3.5x2.8mm SURFACE MOUNT SMD CHIP LED M2BG Published Date : FEB 25,2008 Drawing No : SDSA6178 V1 Checked : B.L.LIU P.5/7 Part number: ZM2BBCRBG45S-A www.SunLED.com 3.5x2.8mm SURFACE MOUNT SMD CHIP LED Recommended Soldering Pattern (Units : mm;Tolerance: 0.1) The device has a single mounting surface. The device must be mounted according to the specifications. Tape Specification (Units : mm) Remarks: If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous Intensity / Luminous Flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Published Date : FEB 25,2008 Drawing No : SDSA6178 V1 Checked : B.L.LIU P.6/7 Part number: ZM2BBCRBG45S-A www.SunLED.com 3.5x2.8mm SURFACE MOUNT SMD CHIP LED PACKING & LABEL SPECIFICATIONS ZM2BBCRBG45S-A Published Date : FEB 25,2008 Drawing No : SDSA6178 V1 Checked : B.L.LIU P.7/7 |
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